1.G-11 High TEMP board.
2.G-11 High TEMP board are made of alkali-free E-glass cloth impregnated with epoxy resins by being processed under heat and pressure.
3.G-11 High TEMP board is mainly used in Mechanical,electrical and electronic applications.extremely high mechanical strength at moderate temperature.very good stability of electrical properties in high humidity.high mechanical strength at elevated temperature.
4.The size of G-11 High TEMP board:
area:1020x1220mm(40"x48");1020x2040mm(40"x80");1220x2440mm(48"x96")
Thickness:0.08-100mm(0.0031-3.94")
5.Gained the ISO9001 certificate.
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Item
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Unit
|
Value
|
|
G-11 High TEMP board
|
|
Density
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g/cm3
|
1.7-1.9
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|
Flexural strength perpendicular to lamination under normal conditions ≥
|
MPa
|
340
|
|
Bonding strength (≥10mm in thickness) ≥
|
N
|
6500
|
|
Impact strength parallel to lamination (charpy) ≥
|
kJ/m2
|
37
|
|
Voltage endurance perpendicular to lamination in transformer oil 1 minute at 90±2oC, Thickness1.0mm ≥
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kV/mm
|
14.2
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Voltage endurance parallel to lamination under normal conditions ≥
|
kV
|
35
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|
Insulation resistance after impregnated in water ≥
|
MΩ
|
5×104
|
|
Dissipation factor ≤
50Hz:
1MHz:
|
-
|
0.04
0.04
|
|
Relative dielectric constant ≤
50Hz:
1MHz:
|
-
|
5.5
5.5
|
|
Water absorption rate ≤
|
%
|
0.25
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